Semiconductor device having barrier layer to prevent impurity diffusion

ABSTRACT

A semiconductor device includes a semiconductor substrate having a first conductivity type region including a first conductivity type impurity. A first gate structure is on the semiconductor substrate overlying the first conductivity type region. A second conductivity type region including a second conductivity type impurity is formed in the semiconductor substrate. A barrier layer is located between the first conductivity type region and the second conductivity type region. The barrier layer prevents diffusion of the second conductivity type impurity from the second conductivity type region into the first conductivity type region.

CROSS REFERENCE TO RELATED APPLICATION

This Application is a Divisional Application of U.S. Ser. No. 14/681,045filed Apr. 7, 2015, now U.S. Pat. No. 9,728,598 issued Aug. 8, 2017, thesubject matter of which is incorporated herein by reference in entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs.

Such scaling down has also increased the complexity of processing andmanufacturing ICs and, for these advances to be realized, similardevelopments in IC processing and manufacturing are needed. For example,although existing FET devices and methods of fabricating FET deviceshave been generally adequate for their intended purposes, they have notbeen entirely satisfactory in all respects. For example, as the devicesbecome smaller, leakage current paths between different conductivitytype regions become a bigger problem.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features may not be drawn to scale. In fact, the dimensions ofthe various features may be arbitrarily increased or reduced for clarityof discussion.

FIGS. 1-5 show an exemplary method for manufacturing a semiconductordevice and a semiconductor device in accordance with an embodiment ofthe disclosure.

FIGS. 6-8 show an exemplary method for manufacturing a semiconductordevice and a semiconductor device in accordance with an embodiment ofthe disclosure.

FIG. 9 illustrates a semiconductor device in accordance with anembodiment of the disclosure.

FIG. 10 is an isometric view of a semiconductor device in accordancewith an embodiment of the disclosure.

FIG. 11 is a cross section along line A-A′ of FIG. 10 in accordance withan embodiment of the disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the present disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Examples of devices that can benefit from one or more embodiments of thepresent disclosure are semiconductor devices. Such a device, forexample, is a field effect transistor (FET). The FET device, forexample, may be a complementary metal-oxide-semiconductor (CMOS) devicecomprising a p-type metal-oxide-semiconductor (PMOS) FET device and ann-type metal-oxide-semiconductor (NMOS) FET device. The followingdisclosure will include FET examples to illustrate various embodimentsof the present application. It is understood, however, that theapplication should not be limited to a particular type of device, exceptas specifically claimed.

In an embodiment of the disclosure, a semiconductor substrate 12including a first conductivity type impurity is provided, as shown inFIG. 1. In one embodiment, the semiconductor substrate 12 is a siliconsubstrate. Alternatively, the semiconductor substrate may includegermanium, silicon germanium, gallium arsenide or other appropriatesemiconductor materials. Also alternatively, the semiconductor substratemay include an epitaxial layer. For example, the semiconductor substratemay have an epitaxial layer overlying a bulk semiconductor. Further, thesemiconductor substrate may be strained for performance enhancement. Forexample, the epitaxial layer may include a semiconductor materialdifferent from that of the bulk semiconductor, such as a layer ofsilicon germanium overlying bulk silicon or a layer of silicon overlyingbulk silicon germanium. Such strained substrates may be formed byselective epitaxial growth (SEG). Furthermore, the semiconductorsubstrate may include a semiconductor-on-insulator (SOI) structure. Alsoalternatively, the semiconductor substrate may include a burieddielectric layer, such as a buried oxide (BOX) layer, such as thatformed by separation by implantation of oxygen (SIMOX) technology, waferbonding, SEG, or other appropriate method. In other embodiments, thesubstrate may comprise a compound semiconductor including IV-IV compoundsemiconductors such as SiC and SiGe, III-V compound semiconductors suchas GaAs, GaP, GaN, InP, InAs, InSb, GaAsP, AlGaN, AlInAs, AlGaAs,GaInAs, GaInP, and/or GaInAsP; or combinations thereof.

The semiconductor substrate 12 includes an impurity. In some embodimentsthe conductivity type of the impurity is p-type. The p-type impurity maybe boron, aluminum, or gallium in some embodiments.

One or more gate structures 14 are formed over the semiconductorsubstrate in a certain embodiment, as shown in FIG. 2. The gatestructures 14 include a gate electrode 16 formed over a gate dielectriclayer 24. Insulating sidewall spacers 22 may be formed on sidewalls ofthe gate electrode 16. In some embodiments, the sidewall spacers 22 maycomprise a plurality of layers 18, 20. In certain embodiments, theplurality of layers 18, 22 may formed of the same or differentmaterials. For example, the inner layer 20 and outer layer 18 may be asilicon nitride layer. In alternate embodiments, the inner layer 20 maybe thermal oxide layer formed by oxidizing the surface of gate electrode16, and the outer layer 18 may be formed of a deposited silicon nitride.Other suitable materials for forming the sidewalls include siliconcarbide and silicon oxynitride.

The gate dielectric 24 may comprise silicon oxide, silicon nitride,silicon oxynitride, high-k dielectric material, other suitabledielectric material, and/or combinations thereof. The gate electrode 16may comprise any suitable material, such as polysilicon, aluminum,copper, titanium, tantalum, tungsten, molybdenum, tantalum nitride,nickel silicide, cobalt silicide, TiN, WN, TiAl, TiAlN, TaCN, TaC,TaSiN, metal alloys, other suitable materials, or combinations thereof.

In certain embodiments, the semiconductor device can be fabricated usinga gate first method or a gate last method. In embodiments using a high-kgate dielectric layer and a metal gate (HK/MG), a gate last method isemployed to form the gate electrode. In the gate last method, a dummygate is formed, the dummy gate is subsequently removed at a lateroperation after a high temperature annealing operation, and the high-kgate dielectric layer and metal gate (HK/MG) are formed.

According to embodiments of the disclosure, the high k gate dielectricmay comprise HfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide,aluminum oxide, hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, othersuitable high-k dielectric materials, or combinations thereof. The metalgate material may comprise one or more layers of Ti, TiN,titanium-aluminum alloy, Al, AlN, Ta, TaN, TaC, TaCN, TaSi, and thelike.

In some embodiments, the sidewall spacers 22 can be used to offsetsubsequently formed doped regions, such as source/drain regions. Thesidewall spacers 22 may further be used for designing or modifying thesource/drain region (junction) profile. The sidewall spacers 22 may beformed by suitable deposition and etch techniques.

After forming the gate structures 14, the semiconductor substrate 12 maybe etched to form a trench 25, as shown in FIG. 3. Any suitable etchantand etching technique can be used. The semiconductor substrate may beetched by various methods, including a dry etch, a wet etch, or acombination of dry etch and wet etch. The wet etching process may use ahot aqueous caustic, including potassium hydroxide (KOH), an aqueoussolution of ethylene diamine and pyrocatechol (EDP), andtetramethylammonium hydroxide (TMAH). An acidic wet etchant, such asnitric acid (HNO₃)+hydrofluoric acid (HF) can also be used. The dryetching process may implement fluorine-containing gas (e.g., CF₄, SF₆,CH₂F₂, CHF₃, and/or C₄F₈), chlorine-containing gas (e.g., Cl₂, CHCl₃,CCl₄, and/or BCl₃), bromine-containing gas (e.g., HBr and/or CHBr₃),oxygen-containing gas, iodine-containing gas, other suitable gasesand/or plasmas, or combinations thereof. The etching process may includea multiple-step etching to gain etch selectivity, flexibility, anddesired etch profile. In certain embodiments, TMAH is used to provide adiamond-shaped trench 25, as shown in FIG. 3. The semiconductorsubstrate 12 may be formed from silicon having an (110) orientation.

A barrier layer 28 is formed on walls 26 of the trench in certainembodiments of the present disclosure, as shown in FIG. 4. The barrierlayer 28 can be formed by depositing a barrier layer material on thetrench wall 26 or implanting a barrier dopant material in the trenchwall 26. The barrier layer 28 blocks dopants in source/drain regionsthat are subsequently formed in the trench 25 from diffusing into thesemiconductor substrate 12. The barrier layer 28 can be deposited bychemical vapor deposition (CVD) deposition techniques (e.g., vapor-phaseepitaxy (VPE) and/or ultra-high vacuum CVD (UHV-CVD)), molecular beamepitaxy, atomic layer deposition (ALD), physical vapor deposition (PVD),sputtering, and/or other suitable processes. Alternatively, the barrierlayer can be formed by ion implantation. The sidewall structures 22 canfunction as masks to define where the barrier layer 28 is formed. Incertain embodiments, the barrier layer 28 is formed in a bottom portionof the trench 25, as shown in FIG. 4. In other embodiments, the barrierlayer 28 lines a greater portion or substantially the entire trench wall26.

The barrier layer 28 comprises carbon (C), nitrogen (N), or fluorine (F)in certain embodiments. In certain embodiments, the barrier layer 28comprises C, N, or F as dopant. The concentration of the dopant mayrange from about 1×10¹⁶ cm⁻³ to about 1×10¹⁷ cm⁻³. In certainembodiments, the barrier layer 28 is formed on the trench wall 26 andthe dopant diffuses into the semiconductor substrate 12. Diffusion ofdopant can be facilitated by a thermal annealing operation after thebarrier layer 28 is formed on the trench wall 26. The C, N, and F dopantmay be counter doped, and may constrain ions and reduce diffusiondistance in certain embodiments.

As shown in FIG. 5, a second conductivity type region 30 is formed inthe trench 25, thereby providing a semiconductor device 10. The secondconductivity type region 30 can be an epitaxial layer, and in certainembodiments is deposited by chemical vapor deposition (CVD) techniques(e.g., vapor-phase epitaxy (VPE) and/or ultra-high vacuum CVD(UHV-CVD)), molecular beam epitaxy, atomic layer deposition (ALD),physical vapor deposition (PVD), sputtering, and/or other suitableprocesses. In some embodiments, the second conductivity type region 30includes a low impurity concentration portion 32 and a high impurityconcentration portion 34. In certain embodiments, the secondconductivity type region 30 may be a source or drain region. In someembodiments, the second conductivity type region 30 may be a raisedsource/drain region. The raised source/drain region may be a sharedsource/drain region, as illustrated in FIG. 5. In some embodiments, theconductivity type of the second conductivity type region 30 may be ann-type. Suitable n-type impurities include antimony (Sb), arsenic (As),or phosphorus (P).

As shown in FIG. 5, the semiconductor device 10 according to anembodiment of the present disclosure includes a semiconductor substrate12 having a first conductivity type region 13 including a firstconductivity type impurity. The gate structure 14 is formed on thesemiconductor substrate 12 overlying the first conductivity type region13. A second conductivity type region 30 includes a second conductivitytype impurity formed in the semiconductor substrate 12. A barrier layer28 is located between the first conductivity type region 13 and thesecond conductivity type region 30. The barrier layer 28 preventsdiffusion of the second conductivity type impurity from the secondconductivity type region 30 into the first conductivity type region 13.

In some embodiments, the impurity concentration in the high impurityconcentration portion 34 of the second conductivity region 30 is about10 times greater than the impurity concentration of the low impurityconcentration portion 32. The impurity concentration in the low impurityconcentration portion 32 may range from about 1×10¹⁵ cm⁻³ to about9×10²⁰ cm⁻³. The impurity concentration in the high impurityconcentration portion 34 may range from about 1×10¹⁶ cm⁻³ to about9×10²¹ cm⁻³.

In some embodiments of the disclosure, the thickness t1 of the barrierlayer ranges from about 0.5 nm to about 20 nm. The thickness t2 of thesecond conductivity type impurity region may range from about 2t1 toabout 20t1. In some embodiments, the thickness t2 of the secondconductivity region 30 ranges from about 5 nm to about 20 nm.

In another embodiment of the disclosure, a first and second gatestructures 14 are formed adjacent each other overlying the firstconductivity type region 13. A second conductivity type region 30including a second conductivity type impurity is formed in thesemiconductor substrate 12 between the first gate structure 14 and thesecond gate structure 14, thereby forming a shared source or drainregion.

Any suitable trench shape and trench depth can be formed, in addition tothe diamond shape trench 25 depending on the particular etchant type andetching operation. For example, a trench 36 with substantially verticalwalls 38 can be formed by use of an anisotropic etching operation, asillustrated in FIG. 6. A barrier layer 40 is subsequently formed by asuitable deposition or implantation process, as shown in FIG. 7. Asecond conductivity type region 42 is deposited in the trench 36 therebyforming a semiconductor device 50, as shown in FIG. 8. In someembodiments, the second conductivity type region 42 includes a lowimpurity concentration portion 44 and a high impurity concentrationportion 46.

Adverting to FIG. 9, another embodiment of the disclosure is asemiconductor device 60 including a plurality of FETs 61 having source64 and drain 66 regions on opposing sides of the gate structures 14. Abarrier layer 68 is formed between the source 64 and drain 66 regionsand the first conductivity type region 13. Shallow trench isolation(STI) regions 62 isolate adjacent field effect transistors 61.

The STI regions 62 may comprise silicon oxide, silicon nitride, siliconoxynitride, other suitable materials, and combinations thereof. STIregions may be formed by any suitable process. As one embodiment, theSTI regions are formed by filling a trench between the field effecttransistors with one or more dielectric materials by using a chemicalvapor deposition (CVD). In some embodiments, the filled region may havea multi-layer structure such as a thermal oxide liner layer filled withsilicon nitride or silicon oxide. An annealing process may be performedafter the formation of the STI region. The annealing process includesrapid thermal annealing (RTA), laser annealing processes, or othersuitable annealing processes.

In some embodiments, the STI regions are formed using flowable CVD. Inthe flowable CVD, flowable dielectric materials instead of silicon oxideare deposited. Flowable dielectric materials, as their name suggest, can“flow” during deposition to fill gaps or spaces with a high aspectratio. Usually, various chemistries are added to silicon-containingprecursors to allow the deposited film to flow. In some embodiments,nitrogen hydride bonds are added. Examples of flowable dielectricprecursors, particularly flowable silicon oxide precursors, include asilicate, a siloxane, a methyl silsesquioxane (MSQ), a hydrogensilsesquioxane (HSQ), an MSQ/HSQ, a perhydrosilazane (TCPS), aperhydro-polysilazane (PSZ), a tetraethyl orthosilicate (TEOS), or asilyl-amine, such as trisilylamine (TSA). These flowable silicon oxidematerials are formed in a multiple-operation process. After the flowablefilm is deposited, it is cured and then annealed to remove un-desiredelement(s) to form silicon oxide. When the un-desired element(s) isremoved, the flowable film densifies and shrinks. In some embodiments,multiple anneal processes are conducted. The flowable film is cured andannealed more than once at temperatures, such as in a range from about1000° C. to about 1200° C., and for an extended period, such as 30 hoursor more in total. In some embodiments, a chemical mechanical polishing(CMP) operation is performed to remove excess material from the STIregion and to provide a substantially planar surface.

As shown in FIG. 10, the semiconductor device is a fin-like field-effecttransistor (Fin FET) 70 in certain embodiments. The Fin FET 70, includesa fin 72 formed on a semiconductor substrate 12. The fin 72 includes animpurity having a first conductivity type. A gate structure 74 formed onthe fin 72 includes a gate electrode 76 overlying a gate dielectric 78.Source 80 and drain 82 regions of a second conductivity type are formedoverlying the fin 72 on opposing sides of the gate electrode 76. STIregions 86 are formed on the semiconductor substrate 12 along lowerportions of the fin 72.

FIG. 11 is a cross section view taken along line A-A′ showing thebarrier layer 84 formed between the source 80 and drain 82 regions andthe first conductivity type region 88 to prevent diffusion of impuritiesfrom the source 80 and drain 82 regions into the first conductivity typeregions 88 of the fin 72.

The semiconductor device 70 is not limited to a single fin 72. In someembodiments, a semiconductor device includes a plurality of finsarranged substantially parallel to each other. In some embodiments, thesource and drain regions of adjacent fins are in direct physical contactwith respective neighboring drain source and drain regions.

In certain embodiments of the disclosure, a method for manufacturing asemiconductor device is provided. The method includes an operation offorming a barrier layer on or in a first conductivity type semiconductorsubstrate, and an operation of forming a second conductivity type regionincluding a second conductivity type impurity in the semiconductorsubstrate so that the semiconductor substrate includes the secondconductivity type region and the first conductivity type region. Thebarrier layer is between the second conductivity type region and thefirst conductivity type region, and the barrier layer prevents diffusionof the second conductivity type impurity from the second conductivitytype region into the first conductivity type region.

In some embodiments, prior to the operation of forming the secondconductivity type region, the semiconductor substrate is etched to forma trench at a region where the second conductivity type region is to beformed.

In some embodiments the barrier layer is formed on surfaces of thetrench. The barrier layer includes carbon, nitrogen, or fluorine. Thebarrier layer may be formed by introducing impurities into thesemiconductor substrate, and the impurities may be introduced byimplantation.

In certain embodiments, the second conductivity type region is formed byan operation of depositing an epitaxial layer over the barrier layer.

Impurities can diffuse from a one conductivity type region to anotherconductivity type region in a semiconductor device. For example ann-type impurity, such as phosphorus, can diffuse from an n-typeepitaxial region to a p-type well, thereby inducing a current leakagepath. The prevention of leakage current paths is an importantconsideration as semiconductor device size shrinks. The leakage currentcan damage a semiconductor device.

Forming a barrier layer between a well of a first conductivity type anda source/drain region of a second conductivity type can prevent ordecrease diffusion of the second conductivity type impurity into thefirst conductivity type well and thereby prevent leakage current pathsfrom forming and subsequent damage to the semiconductor device. Thus,the barrier layer can improve device reliability. Forming the barrierlayer on only the bottom portion of the source/drain regions has littleor no impact on the resistance of the source and drain regions. Thus,forming the barrier layer between the source/drain regions and the wellimproves semiconductor reliability with little or no detrimental effecton device performance.

According to an embodiment of the disclosure, a semiconductor deviceincludes a semiconductor substrate having a first conductivity typeregion including a first conductivity type impurity. A first gatestructure is on the semiconductor substrate overlying the firstconductivity type region. A second conductivity type region including asecond conductivity type impurity is formed in the semiconductorsubstrate. A barrier layer is located between the first conductivitytype region and the second conductivity type region. The barrier layerprevents diffusion of the second conductivity type impurity from thesecond conductivity type region into the first conductivity type region.

According to another embodiment of the disclosure, a semiconductorsubstrate has a first conductivity type region including a firstconductivity type impurity. A first gate structure is on thesemiconductor substrate overlying the first conductivity type region. Asecond gate structure is on the semiconductor substrate overlying thefirst conductivity type region and adjacent the first gate structure. Asecond conductivity type region including a second conductivity typeimpurity is formed in the semiconductor substrate between the first gatestructure and the second gate structure. A barrier layer is locatedbetween the first conductivity type region and the second conductivitytype region. The barrier layer prevents diffusion of the secondconductivity type impurity from the second conductivity type region intothe first conductivity type region.

According to yet another embodiment of the disclosure, a method formanufacturing a semiconductor device includes forming a barrier layer ina first conductivity type semiconductor substrate, and forming a secondconductivity type region having a second conductivity type impurity inthe semiconductor substrate so that the semiconductor substrate includesthe second conductivity type region and the first conductivity typeregion. The barrier layer is between the second conductivity type regionand the first conductivity type region, and the barrier layer preventsdiffusion of the second conductivity type impurity from the secondconductivity type region into the first conductivity type region.

As one of skill in the art would recognize some of the steps describedin the above methods can be replaced or eliminated for other embodimentsof the method.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductor devicecomprising: forming a first gate structure and a second gate structureon a semiconductor substrate having a first conductivity type includinga first conductivity type impurity; forming a barrier layer in thesemiconductor substrate between the first gate structure and the secondgate structure; forming a second conductivity type region comprising asecond conductivity type impurity over the barrier layer, wherein thebarrier layer is in direct contact with and is between the secondconductivity type region and the first conductivity type region, and thebarrier layer prevents diffusion of the second conductivity typeimpurity from the second conductivity type region into the firstconductivity type region.
 2. The method according to claim 1, whereinthe second conductivity type region comprises: a low concentrationportion; and a high concentration portion having about a 10 timesgreater amount of impurity than the low concentration portion.
 3. Themethod according to claim 1, wherein the second conductivity type regionis deposited on the barrier layer by chemical vapor deposition (CVD),vapor-phase epitaxy, ultra-high vacuum CVD, atomic layer deposition, orphysical vapor deposition.
 4. The method according to claim 1, furthercomprising: forming a trench in the substrate between the first gatestructure and the second gate structure before forming the barrierlayer; and depositing a barrier layer material on a wall of the trenchto form the barrier layer.
 5. The method according to claim 4, whereinthe barrier layer material is deposited on the wall of the trench bychemical vapor deposition (CVD), vapor-phase epitaxy, ultra-high vacuumCVD, atomic layer deposition, or physical vapor deposition.
 6. Themethod according to claim 1, further comprising: forming a trench in thesubstrate between the first gate structure and the second gate structurebefore forming the barrier layer; and implanting a barrier dopantmaterial in a wall of the trench to form the barrier layer.
 7. Themethod according to claim 6, wherein the dopant material is carbon,nitrogen, or fluorine.
 8. A semiconductor device comprising: asemiconductor substrate having a first conductivity type regionincluding a first conductivity type impurity; a first gate structure onthe semiconductor substrate overlying the first conductivity typeregion; a second gate structure on the semiconductor substrate overlyingthe first conductivity type region and adjacent the first gatestructure; source and drain regions having including a secondconductivity type impurity formed in the semiconductor substrate betweenthe first gate structure and the second gate structure, wherein thesource and drain regions are separated by a shallow trench isolationregion; and a barrier layer located between the substrate and the sourceand drain regions, wherein the barrier layer prevents diffusion of thesecond conductivity type impurity from the source and drain regions intothe substrate, and wherein the barrier layer is in direct contact withthe source and drain regions.
 9. The semiconductor device of claim 8,wherein the barrier layer comprises carbon, nitrogen, or fluorine. 10.The semiconductor device of claim 8, wherein a thickness t1 of thebarrier layer ranges from about 0.5 nm to about 20 nm.
 11. Thesemiconductor device of claim 10, wherein a thickness t2 of the secondconductivity type impurity region ranges from about 2t1 to about 20t1.12. A semiconductor device comprising: a semiconductor substrate havinga first conductivity type region including a first conductivity typeimpurity; a first gate structure on the semiconductor substrateoverlying the first conductivity type region; a second gate structure onthe semiconductor substrate overlying the first conductivity type regionand adjacent the first gate structure; a second conductivity type regionincluding a second conductivity type impurity formed in thesemiconductor substrate between the first gate structure and the secondgate structure; and a barrier layer located between the firstconductivity type region and the second conductivity type region,wherein the barrier layer prevents diffusion of the second conductivitytype impurity from the second conductivity type region into the firstconductivity type region, wherein the second conductivity type regionincludes a first portion and a second portion, wherein the secondportion contains a higher concentration of the second conductivity typeimpurity than the first portion, and wherein the first portion and thesecond portion are in direct contact with each other.
 13. Thesemiconductor device of claim 12, wherein the barrier layer comprisescarbon, nitrogen, or fluorine.
 14. The semiconductor device of claim 12,wherein the second conductivity type impurity is phosphorus.
 15. Thesemiconductor device of claim 12, wherein the semiconductor device is afin field-effect transistor.
 16. The semiconductor device of claim 12,wherein a thickness t1 of the barrier layer ranges from about 0.5 nm toabout 20 nm.
 17. The semiconductor device of claim 16, wherein athickness t2 of the second conductivity type impurity region ranges fromabout 2t1 to about 20t1.
 18. The semiconductor device of claim 12,wherein the second conductivity type region is a source or drain region.19. The semiconductor device of claim 18, wherein the source or drainregion is a shared source or drain region.
 20. The semiconductor deviceof claim 18, wherein the source and drain regions are raised source anddrain regions.